Evaluation of pure tin plated copper alloy substrates for...

Circuit World 2009 / 02 Vol. 35; Iss. 1

Evaluation of pure tin plated copper alloy substrates for tin whiskers

Mathew, Sony, Osterman, Michael, Pecht, Michael, Dunlevey, Frank
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Volume:
35
Language:
english
Journal:
Circuit World
DOI:
10.1108/03056120910928662
Date:
February, 2009
File:
PDF, 354 KB
english, 2009
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