Detection of flip chip solder joint cracks using...

IEEE Transactions on Components and Packaging Technologies 2006 / 3 Vol. 29; Iss. 1

Detection of flip chip solder joint cracks using correlation coefficient and auto-comparison analyses of laser ultrasound signals

Lizheng Zhang,, Ume, I.C., Gamalski, J., Galuschki, K.-P.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/TCAPT.2005.848567
Date:
March, 2006
File:
PDF, 1.51 MB
english, 2006
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