Solder Joint Formation in Surface Mount Technology—Part I:...

Journal of Electronic Packaging 1990 Vol. 112; Iss. 3

Solder Joint Formation in Surface Mount Technology—Part I: Analysis

Heinrich, S. M., Elkouh, A. F., Nigro, N. J., Lee, Ping S.
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Volume:
112
Year:
1990
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2904369
File:
PDF, 805 KB
english, 1990
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