Board Level Drop Test Analysis Based on Modal Test and...

Board Level Drop Test Analysis Based on Modal Test and Simulation

Liu, Fang, Meng, Guang, Zhao, Mei, Zhao, Junfeng
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Volume:
130
Year:
2008
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2912212
File:
PDF, 1.06 MB
english, 2008
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