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[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Shadow Moiré Evaluation of Motherboard Warpage Under Preload CPU Thermal Solutions
Geng, Phil, Martinson, Robert R., Williams, Richard L., Mello, Michael, Cho, SteveYear:
2005
Language:
english
DOI:
10.1115/ipack2005-73046
File:
PDF, 503 KB
english, 2005