[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan
Jalilvand, Ahmad, Mochizuki, Masataka, Saito, Yuji, Kawahara, Yoji, Wuttijumnong, Vijit, Nguyen, ThangYear:
2011
Language:
english
DOI:
10.1115/ipack2011-52267
File:
PDF, 895 KB
english, 2011