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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors
Hempel, Jochen, Zukowski, Elena, Berndt, Michael, Anees, Sohaib, Wilde, Jürgen, Reindl, Leonhard M.Year:
2013
Language:
english
DOI:
10.1115/ipack2013-73258
File:
PDF, 2.22 MB
english, 2013