Numerical simulation of thermal conductivity of MMCs:...

Materials Science and Technology 2003 / 08 Vol. 19; Iss. 8

Numerical simulation of thermal conductivity of MMCs: effect of thermal interface resistance

Duschlbauer, D., Böhm, H. J., Pettermann, H. E.
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Volume:
19
Language:
english
Journal:
Materials Science and Technology
DOI:
10.1179/026708303225004305
Date:
August, 2003
File:
PDF, 2.88 MB
english, 2003
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