CBGA solder joint thermal fatigue life estimation by a simple method
Wong, T.E., Lau, C.Y., Fenger, H.S.Volume:
16
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910410537327
Date:
August, 2004
File:
PDF, 263 KB
english, 2004