A Creep Model for Solder Alloys

A Creep Model for Solder Alloys

Lee, Yongchang, Basaran, Cemal
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Volume:
133
Year:
2011
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4005288
File:
PDF, 1.18 MB
english, 2011
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