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[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 2 - Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics
Chiriac, Victor AdrianYear:
2009
Language:
english
DOI:
10.1115/interpack2009-89111
File:
PDF, 741 KB
english, 2009