[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Future of Thermal Management of High End Video Cards in ATX and BTX
Refai-Ahmed, Gamal, Tantoush, Mohammed, Novak, ColinYear:
2005
Language:
english
DOI:
10.1115/ipack2005-73219
File:
PDF, 478 KB
english, 2005