[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency
Breen, Thomas J., Walsh, Ed J., Punch, Jeff, Shah, Amip J., Bash, Cullen E., Kumari, Niru, Cader, TahirYear:
2011
Language:
english
DOI:
10.1115/ipack2011-52030
File:
PDF, 770 KB
english, 2011