Reliability of an ultra-fine-pitch COF flip-chip package...

Electronic Materials Letters 2016 / 1 Vol. 12; Iss. 1

Reliability of an ultra-fine-pitch COF flip-chip package using non-conductive paste

Kim, Hae-Yeon, Min, Kyung-Eun, Lee, Jun-Sik, Lee, So-Jeong, Lee, Sung-Soo, Kim, Jun-Ki
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Volume:
12
Language:
english
Journal:
Electronic Materials Letters
DOI:
10.1007/s13391-015-2235-1
Date:
January, 2016
File:
PDF, 1.30 MB
english, 2016
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