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[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (Sunday 6 July 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 - Modeling and Thermal Optimization of a Micro Heat Pipe With Curved Triangular Grooves
Do, Kyu Hyung, Kim, Sung Jin, Hwang, GunnYear:
2003
Language:
english
DOI:
10.1115/ipack2003-35116
File:
PDF, 359 KB
english, 2003