[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (Sunday 6 July 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 - Pool Boiling of Water and FC-72 on Copper and Graphite Foams
Moghaddam, Saeed, Ohadi, Michael, Qi, JianweiYear:
2003
Language:
english
DOI:
10.1115/ipack2003-35316
File:
PDF, 327 KB
english, 2003