[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - TSV noise coupling in 3D IC using guard ring
Reddy, R Ranga, Tanna, Sugandh, Singh, Shiv Govind, Singh, Om KrishnaYear:
2015
Language:
english
DOI:
10.1109/3DIC.2015.7334606
File:
PDF, 968 KB
english, 2015