![](/img/cover-not-exists.png)
[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 4 - Investigating the Effect of Power Distribution on Cooling a Double-Sided PCB: Numerical Simulation and Experiment
Johansson, Jonas, Belov, Ilja, Leisner, PeterYear:
2005
Language:
english
DOI:
10.1115/ht2005-72549
File:
PDF, 747 KB
english, 2005