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[ASME ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME 2007 InterPACK Conference, Volume 1 - Analytical Modeling of Energy Consumption and Thermal Performance of Data Center Cooling Systems: From the Chip to the Environment
Iyengar, Madhusudan, Schmidt, Roger R.Year:
2007
Language:
english
DOI:
10.1115/ipack2007-33924
File:
PDF, 302 KB
english, 2007