Impact Isolation Through the Use of Compliant Interconnects...

Journal of Electronic Packaging 2015 / 10 Vol. 137; Iss. 4

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Chen, Wei, Bhat, Anirudh, Sitaraman, Suresh K.
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Volume:
137
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4031680
Date:
October, 2015
File:
PDF, 4.28 MB
english, 2015
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