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[ASME ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME 2007 InterPACK Conference, Volume 1 - Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors
Mochizuki, Masataka, Saito, Yuji, Kiyooka, Fumitoshi, Nguyen, Thang, Nguyen, Tien, Wuttijumnong, VijitYear:
2007
Language:
english
DOI:
10.1115/ipack2007-33611
File:
PDF, 1.18 MB
english, 2007