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Evolution of Nano-Grains in High Purity Copper by Accumulative Roll-Bonding Process
Lee, Seong-Hee, Kim, Hyoung-Wook, Lim, Cha-YongVolume:
10
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2010.2287
Date:
May, 2010
File:
PDF, 6.76 MB
english, 2010