Effect of reflow soldering profile on intermetallic...

International Journal of Computer Applications in Technology 2015 Vol. 52; Iss. 4

Effect of reflow soldering profile on intermetallic compound formation

Aisha, I. Siti Rabiatull, Ourdjini, A., Hanim, M.A. Azmah, Azlina, O. Saliza
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Volume:
52
Year:
2015
Language:
english
Journal:
International Journal of Computer Applications in Technology
DOI:
10.1504/ijcat.2015.073590
File:
PDF, 4.27 MB
english, 2015
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