Heat Transfer and Thermal Stress Analysis of an...

Journal of Electronic Packaging 1991 Vol. 113; Iss. 3

Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package

Stack, J. G., Acarlar, M. S.
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Volume:
113
Year:
1991
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905404
File:
PDF, 1.10 MB
english, 1991
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