Response Policies to Process Module Failure in Single-Arm Cluster Tools Subject to Wafer Residency Time Constraints
Qiao, Yan, Pan, Chun-Rong, Wu, Nai-Qi, Zhou, MengChuVolume:
12
Language:
english
Journal:
IEEE Transactions on Automation Science and Engineering
DOI:
10.1109/TASE.2014.2312823
Date:
July, 2015
File:
PDF, 3.43 MB
english, 2015