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Static and dynamic analysis of failure locations and void formation in interconnects due to various migration mechanisms
Kirsten Weide-Zaage, David Dalleau, Xiaoying YuVolume:
6
Year:
2003
Language:
english
Pages:
8
DOI:
10.1016/s1369-8001(03)00075-1
File:
PDF, 624 KB
english, 2003