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Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages
Koguchi, Hideo, Sasaki, Chie, Nishida, KazutoVolume:
125
Year:
2003
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1602705
File:
PDF, 354 KB
english, 2003