[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Effect of Package and Board Pad Size on Optimum Flip Chip Ball Grid Array (FCBGA) Package Thermo-Mechanical Performance
Wong, Chee Wai, Tay, Cheng Siew, Tan, Siew Sang, Vasudevan, Vasu, Goh, Eng Huat, Wong, Shaw FongYear:
2003
Language:
english
DOI:
10.1115/ipack2003-35143
File:
PDF, 1.74 MB
english, 2003