Development of Mold Compounds With Ultralow Coefficient of...

IEEE Transactions on Components Packaging and Manufacturing Technology 2015 / 7 Vol. 5; Iss. 7

Development of Mold Compounds With Ultralow Coefficient of Thermal Expansion and High Glass Transition Temperature for Fan-Out Wafer-Level Packaging

Carias, Vinicio, Thompson, Jeffrey, Myers, Philip D., Kumar, Prashant, Racz, Livia M., Toomey, Ryan, Jing Wang,
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Volume:
5
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2015.2443072
Date:
July, 2015
File:
PDF, 3.34 MB
english, 2015
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