Assembly technology development and failure analysis for three-dimensional integrated circuit integration with ultra-thin chip stacking
Lee, Chang-Chun, Lin, Yu-Min, Hsieh, Chia-Ping, Liou, Yan-Yu, Zhan, Chau-Jie, Chang, Tao-Chih, Wang, Chien-PingLanguage:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2016.01.040
Date:
February, 2016
File:
PDF, 2.12 MB
english, 2016