Ultrasonic bonding of flexible PCB to rigid PCB using an Sn...

Soldering & Surface Mount Technology 2009 / 02 Vol. 21; Iss. 1

Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer

Kim, Kyoo‐Seok, Jung, Jae‐Pil, Norman Zhou, Y.
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Volume:
21
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910910928256
Date:
February, 2009
File:
PDF, 348 KB
english, 2009
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