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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Twin-induced ultra-high thermal conductivity of sintering Ag nanoparticles for high power density electronic packaging
Wang, Shuai, Li, Mingyu, Kim, JongmyungYear:
2014
Language:
english
DOI:
10.1109/ICEPT.2014.6922628
File:
PDF, 667 KB
english, 2014