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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Effects of assembly process states on RF transmission properties in passive microstrip circuit
Qiu, Yingxia, Min, Zhixian, Hu, Jun, Peng, Xuelin, Wang, CongsiYear:
2015
Language:
english
DOI:
10.1109/ICEPT.2015.7236834
File:
PDF, 747 KB
english, 2015