Predicting Scooping and Skipping in Solder Paste Printing...

Soldering & Surface Mount Technology 1993 / 03 Vol. 5; Iss. 3

Predicting Scooping and Skipping in Solder Paste Printing for Reflow Soldering of SMT Devices

Mannan, S.H., Ekere, N.N., Lo, E.K., Ismail, I.
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Volume:
5
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/eb037835
Date:
March, 1993
File:
PDF, 342 KB
english, 1993
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