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Improved adhesion property and electromagnetic interference shielding effectiveness of electroless Cu-plated layer on poly(ethylene terephthalate) by plasma treatment
Kyung Wha Oh, Dong Jun Kim, Seong Hun KimVolume:
84
Year:
2002
Language:
english
Pages:
11
DOI:
10.1002/app.10272
File:
PDF, 275 KB
english, 2002