Reliability of BGA and CSP on Metal-Backed Printed Circuit...

Journal of Electronic Packaging 2007 Vol. 129; Iss. 4

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Lall, Pradeep, Islam, Nokibul, Evans, John, Suhling, Jeff
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Volume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2804086
File:
PDF, 1.18 MB
english, 2007
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