[IEEE 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Taipei, Taiwan (2015.5.26-2015.5.29)] 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Signal integrity design of bump-less interconnection for high-speed signaling in 2.5D and 3D IC

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.