[IEEE 2014 Sixth International Conference on Wireless...

  • Main
  • [IEEE 2014 Sixth International...

[IEEE 2014 Sixth International Conference on Wireless Communications and Signal Processing (WCSP) - Hefei, China (2014.10.23-2014.10.25)] 2014 Sixth International Conference on Wireless Communications and Signal Processing (WCSP) - Analysis on scattering parameters for coupled microstrip lines with bend discontinuities

He, Jiao, Gui, Liangqi, Jiang, Tao, Zhou, Cong, Lv, Lang
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2014
Language:
english
DOI:
10.1109/WCSP.2014.6992021
File:
PDF, 273 KB
english, 2014
Conversion to is in progress
Conversion to is failed