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Hybrid erosive jet micro-milling of sintered ceramic wafers with and without copper-filled through-holes
Kowsari, K., Sookhaklari, M.R., Nouraei, H., Papini, M., Spelt, J.K.Volume:
230
Language:
english
Journal:
Journal of Materials Processing Technology
DOI:
10.1016/j.jmatprotec.2015.11.027
Date:
April, 2016
File:
PDF, 3.24 MB
english, 2016