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The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing
Hsiao, Yu-Hsiang, Lin, Kwang-LungVolume:
27
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-4011-2
Date:
March, 2016
File:
PDF, 1.66 MB
english, 2016