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The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction
Huang, Chien‐Yi, Lin, Yueh‐Hsun, Ying, Kuo‐Ching, Ku, Chen‐LiangVolume:
23
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540911111169057
Date:
September, 2011
File:
PDF, 506 KB
english, 2011