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Sic-Reinforced Aluminum-Silicon Composite via Pressureless Infiltration Using Polystyrene as External Binder for Electronic Assemblies
Mohd Salim, Nurul Nadia, Zuhailawati, H., Mohamad, Hasmaliza, Anasyida, A.S.Volume:
819
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.819.220
Date:
June, 2015
File:
PDF, 451 KB
english, 2015