Low-Loss Air-Cavity Through-Silicon Vias (TSVs) for High...

IEEE Microwave and Wireless Components Letters 2016 / 2 Vol. 26; Iss. 2

Low-Loss Air-Cavity Through-Silicon Vias (TSVs) for High Speed Three-Dimensional Integrated Circuits (3-D ICs)

Liu, Xiaoxian, Zhu, Zhangming, Yang, Yintang, Ding, Ruixue
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Volume:
26
Language:
english
Journal:
IEEE Microwave and Wireless Components Letters
DOI:
10.1109/LMWC.2016.2517325
Date:
February, 2016
File:
PDF, 561 KB
english, 2016
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