The investigation of flip-chip eutectic bonding on the performance and lifetime of light emitting diodes
Ying, Shang-Ping, Wang, Chien-Ping, Su, Yi-Ching, Chang, Tien-LiVolume:
160
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2016.02.052
Date:
July, 2016
File:
PDF, 1007 KB
english, 2016