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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - A novel bump-CPW-bump structure for interconnection/transition of RF MEMS packaging
Li, Ning, Wu, Yuluan, Chen, Lei, Wu, Baozhen, Zhao, Cheng, Wang, Yi, Sun, YueYear:
2015
Language:
english
DOI:
10.1109/ICEPT.2015.7236712
File:
PDF, 308 KB
english, 2015