![](/img/cover-not-exists.png)
[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Embedded planar power inductor technology for package-level DC power grid
Kondo, Yuta, Yazaki, Yuichiro, Sonehara, Makoto, Sato, Toshiro, Watanabe, Tetsuro, Seino, Yuto, Matsushita, Nobuhiro, Fujii, Tomoharu, Kobayashi, Kazutaka, Shimizu, Hiroshi, Yanagisawa, Yuki, Someya,Year:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111123
File:
PDF, 2.77 MB
english, 2015