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[IEEE 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hsinchu (2015.6.29-2015.7.2)] 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - Cu via process optimization by electro-migration estimation testing
YiHeng Chen,, Hui-Lan Sung,, Shao-Jui Lo,Year:
2015
DOI:
10.1109/ipfa.2015.7224330
File:
PDF, 869 KB
2015