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[IEEE 2015 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2015.4.19-2015.4.23)] 2015 IEEE International Reliability Physics Symposium - Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress
Slottke, D., Kamaladasa, R.J., Harmes, M., Tsamaret, I., Kobrinsky, M., McMullen, Timothy, Dunklee, JohnYear:
2015
Language:
english
DOI:
10.1109/irps.2015.7112806
File:
PDF, 356 KB
english, 2015