Chip to Facility Ramifications of Containment Solution on...

IEEE Transactions on Components Packaging and Manufacturing Technology 2016 / 1 Vol. 6; Iss. 1

Chip to Facility Ramifications of Containment Solution on IT Airflow and Uptime

Alissa, Husam A., Nemati, Kourosh, Sammakia, Bahgat G., Schneebeli, Ken, Schmidt, Roger R., Seymour, Mark J.
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Volume:
6
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2015.2508453
Date:
January, 2016
File:
PDF, 2.37 MB
english, 2016
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