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[Communications in Computer and Information Science] Computer Engineering and Technology Volume 592 || Thermal-Aware Floorplanner for Multi-core 3D ICs with Interlayer Cooling
Xu, Weixia, Xiao, Liquan, Li, Jinwen, Zhang, ChengyiVolume:
10.1007/97
Year:
2016
Language:
english
DOI:
10.1007/978-3-662-49283-3_3
File:
PDF, 726 KB
english, 2016